Epoxy Resin Filler for Faster Application: StoPox WB 50
With its new formula, the epoxy resin filler “StoPox WB 50” speeds up construction site processes. It is designed for filling and partial reprofiling of tunnel inner shells and is also suitable for protecting and repairing concrete components. The aqueous epoxy resin filler from StoCretec
GmbH is now easier and faster to apply. It hardens quickly even at low temperatures and, depending on the ambient conditions, can be reworked after approximately three hours. This can significantly reduce downtime required for construction work.
Applicable Even Under Difficult Conditions
“With its new formula, the filler offers excellent processing properties,” reports Alexander Jurecka, product manager for concrete repair products at StoCretec. The thixotropic material enables good pore and void closure with a maximum layer thickness of 4 mm. It can be applied quickly and with little effort. “Initial practical tests in a Swiss tunnel showed that workers were able to significantly increase the surface area covered with StoPox WB 50 compared to the previous material,” Jurecka continues.
StoPox WB 50 is applied directly to the prepared surface. As no further treatment is necessary, the filled surface can be reworked quickly. This reduces waiting times between application layers and closure periods. The good processing properties are retained even under difficult conditions such as draughts, cold or high humidity. The filler can also be used on existing epoxy resin coatings that are still stable. These do not need to be laboriously removed.
StoPox WB 50 is low-odour, resistant to temperature changes, highly mechanically resistant and resistant to sulphate-containing water. Tools can be easily cleaned with water.
Applications:
On walls (inside and outside) of tunnels, galleries or underpasses, for example
On stable existing epoxy resin coatings
For surface scraping and levelling
For partial reprofiling
For closing pores and cavities
For protecting and repairing concrete structures
